One cannot imagine the world now and in the future without integrated circuits (IC or generally known as chips). With worldwide revenue projected to be about $500 billion by the end of 2019, the chip ...
Abstract: Given the ubiquity of electronic devices and the urgent need to decrease our footprint in the context of global warming and planetary boundaries, it becomes critical to better quantify the ...
Abstract: Thermal performances of 3D stacked TSV (through silicon via) chips filled with copper are investigated based on heat-transfer CFD (computational fluid dynamic) analyses. Emphases are placed ...
Attention: Restrictions on use of AUA, AUAER, and UCF content in third party applications, including artificial intelligence technologies, such as large language models and generative AI. You are ...
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